someone's true colors.color, add, subtract, wafer thin, wafer bump, substrate,

May you move forward with courage and live your true colors. 

願你勇敢前行，活出自己的本來面目。

someone's true colors

idiom

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the kind of person someone really is rather than what the person seems to be:

I thought he was a really sweet guy, but then he got mad and showed his true colors.

I have a friend who's an artist and has sometimes taken a view which I don't agree with very well. He'll hold up a flower and say "look how beautiful it is," and I'll agree. Then he says "I as an artist can see how beautiful this is but you as a scientist take this all apart and it becomes a dull thing," and I think that he's kind of nutty. First of all, the beauty that he sees is available to other people and to me too, I believe. Although I may not be quite as refined aesthetically as he is... I can appreciate the beauty of a flower. At the same time, I see much more about the flower than he sees. I could imagine the cells in there, the complicated actions inside, which also have a beauty. I mean it's not just beauty at this dimension, at one centimeter; there's also beauty at smaller dimensions, the inner structure, also the processes. The fact that the colors in the flower evolved in order to attract insects to pollinate it is interesting; it means that insects can see the color. It adds a question: does this aesthetic sense also exist in the lower forms? Why is it aesthetic? All kinds of interesting questions which the science knowledge only adds to the excitement, the mystery and the awe of a flower. It only adds. I don't understand how it subtracts. ~Richard P. Feynman

(Book: The Pleasure of Finding Things Out https://amzn.to/3NY0yFK)

Allawi’s Victory in Iraq Election Sets Up Period of Uncertainty
By TIMOTHY WILLIAMS and ROD NORDLAND
A secular coalition led by Ayad Allawi, a former prime minister, won a wafer-thin victory, but challenges to the outcome could threaten plans to withdraw American troops.


Sharp to Increase LCD Panel Production on Higher Demand
PC World - USA2 factory in western Japan from 90000 glass substrates per month to 100000 substrates after August. Each substrate measures 2.16 meters by 2.46 meters and ...




wafer
n.

1. A small thin crisp cake, biscuit, or candy.
2. Ecclesiastical. A small thin disk of unleavened bread used in the Eucharist.
3. Pharmacology. A flat tablet of rice paper or dried flour paste encasing a powdered drug.
4. A small disk of adhesive material used as a seal for papers.
5. Electronics. A small thin circular slice of a semiconducting material, such as pure silicon, on which an integrated circuit can be formed.

tr.v., -fered, -fer·ing, -fers.

1. To seal or fasten together with a disk of adhesive material.
2. Pharmacology. To prepare in the form of wafers.
3. Electronics. To divide into wafers.

[Middle English wafre, from Anglo-Norman, variant of Old North French waufre, of Germanic origin.]

Wafer Bump

An alternate interconnect technology to wire-bonding which allows the die to be connected to the other die on a substrate. Some of the different materials being used for the interconnect technology are Gold, Solder (Lead-free) and Copper.

京瓷將從2007年10月起開始工序減至原來的1/2、設備成本降至原來1/10的晶圓凸點（Wafer Bump）形成業務。通過利用在製造熱轉印列印頭過程中累積起來的非電解電鍍技術和高精度絲網印刷技術，降低了成本。

　　一般來說，在晶圓上形成凸點，需要在焊盤上局部形成阻隔膜和焊錫膜。原來使用電解電鍍的方法時，要想僅在焊盤上形成，還需要抗蝕工序。而此次不同，利用能夠對金屬露出部分進行選擇性成膜的非電解電鍍形成阻隔膜後，再通過絲網印刷形成焊錫膜，因而無需進行抗蝕處理。

　 　凸點高50μm，凸點間距最小為120μm。晶圓直徑支援125mm、150mm及200mm三種。由鹿兒島隼人工廠承擔該業務，目標是首年度實現5 億日元的銷售額。此次的晶圓凸點形成技術自02年開始一直應用於京瓷產品。詳細內容將在07年9月12～14日于東京有明國際會展中心舉辦的“第9屆自動 識別展”上公佈。（記者：木村 雅秀）

■日文原文
京セラ，工程1/2，設備コスト1/10のウエハー·バンプ形成事業を開始


substrate

━━ n. 【生化】基質 ((酵素によって作用を受ける物質)); 【生物】培養基, 培地; 【コンピュータ】ICチップの下層.


Wafer Bumping by Electroplating

CuSn-solder bumping on a 6“-silicon-productwafer (ICODE)

Solder bumps for flip chip assembly are deposited be electroplating on the I/O pads of the chips. The basic process steps of wafer bumping are sputtering of a seed layer (UBM), photolithography, electroplating of bump metal, etching of seedlayer and reflow. Bumpstructures of Au, Cu, Ni, SnAg, SnCu, SnAu, PbSn with a dimension of min. 20 µm and with a pitch of 40 µm can be realized by electroplating and height variation of less then <>